For PCB Fabrication & Assembly (F+A) projects, our engineering workflow is executed in two structured stages.First, the bare PCB undergoes fabrication pre-production validation to ensure it meets design and manufacturing requirements. Once the boards are approved and manufactured, the project transitions into the PCB Assembly pre-production phase, where all component-related and assembly parameters are thoroughly verified.This two-level verification process ensures accurate placement, reliable soldering, and high-yield production before assembly begins.
PCB Assembly Engineering Steps
The Bill of Materials (BOM) defines every component required for PCB assembly. A detailed BOM verification is essential to prevent placement errors and sourcing issues.
Each listed component is validated against:
This ensures that the physical component matches the PCB land pattern, preventing misalignment, solder defects, or mounting issues.
Our engineering system performs structured checks to detect:
Early identification of inconsistencies reduces production delays and eliminates assembly errors before manufacturing begins.
The Component Placement List (CPL), also known as the Pick & Place file, defines the exact location, layer, and orientation of each component.
Our engineering team validates this data to ensure seamless automated placement.
All components are reviewed to confirm correct placement on:
Incorrect layer mapping can result in placement failures or assembly delays.
Cross-matched with the BOM to ensure:
This significantly reduces automated placement errors.
Special attention is given to polarized and sensitive components such as:
Rotation angles and polarity markings are verified to prevent functional failures caused by incorrect orientation.
Before physical assembly begins, we conduct a virtual assembly simulation using BOM and CPL data.
This digital validation identifies potential assembly risks and manufacturability issues in advance.
We verify that:
This prevents placement conflicts and solder joint failures.
Proper spacing between components is evaluated to:
Optimized spacing improves long-term reliability and production yield.
Solder paste application parameters are carefully reviewed to ensure:
Excess solder can cause bridging, while insufficient solder may result in weak or cold joints. Proper validation ensures consistent and reliable solder connections.
Designs are checked for potential solder short risks caused by:
Preventive adjustments are recommended before assembly begins.
Fiducial markers are validated to ensure:
Proper fiducial positioning enhances assembly precision and throughput.