Comprehensive assembly tolerances, supported components, and layout feasibility guidelines for high-reliability PCB assembly across complex and precision-driven applications.
| Specification | Details |
|---|---|
| Surface Mount technology (SMT) | Available |
| Through-hole technology (THT) | Available |
| Mixed technology (SMT/Through Hole) | Available |
| Placement Options | Single or double-sided placement |
| Specification | Details |
|---|---|
| Leaded | Available |
| Lead-free (RoHS-compliant) | Available |
| Specification | Details |
|---|---|
| Framed stencil | Available |
| Frameless stencil | Available |
| Specification | Details |
|---|---|
| Minimum Order Constraints | We do not have any minimum order quantity constraints. |
| Specification | Details |
|---|---|
| Passive components | As small as 01005, 0201, 0402 |
| Fine-pitch parts | QFN, QFP |
| Small chip packages | SOIC, PLCC, TSOP, BGA |
| Other Packages | THT, CSP, CCGA, DPAK, Al cap, Tantalum Maximum Size: 56 X 56 X 15 mm |
| Specification | Details |
|---|---|
| Reels | Accepted |
| Cut Tape | Accepted (Must be continuous and a minimum of 12 inches long) |
| Tube & Tray | Accepted |
| Loose Parts | Accepted |
| Specification | Details |
|---|---|
| Clearance from Board's Edge to Component | 3.00 mm (Less than 3.00 mm is acceptable for less than 6 pads towards edge and only for passive components) |
| PCB Board Shapes | Rectangular, Circular and any other Unusual shapes (Note: For non-rectangular shapes, boards must be panelized in an array with a panel border added at the two longer paralleled edges for machine compatibility.) |
| Specification | Details |
|---|---|
| Minimum Pad Size for BGA | 0.20 mm |
| Via on Solder Pad | Available based on design compatibility. Solder passes through via so it is not prominently visible. Note: Functionality is NOT available for BGA. |
| BGA/QFN Pad Edge-to-Edge Clearance Feasibility | |
| • Clearance > 0.17 mm | Viable (without a dam) |
| • Clearance between 0.15 mm and 0.17 mm | Viable only with a dam |
| • Clearance < 0.15 mm | Not feasible or recommended |
| Specification | Details |
|---|---|
| Rigid PCBs | FR4, Rogers, MCPCB |
| Flexible PCBs | Connect with technical team for availability/feasibility |
| Specification | Details |
|---|---|
| Visual Examination Processes | Included |
| X-Ray | Included |
| Automated Optical Inspection | Included |
| Specification | Details |
|---|---|
| BOM | .xls, .csv, .xlsx |
| Gerber | RS-274X |
| Centroid | XY, pick-and-place |
| Specification | Details |
|---|---|
| Absolute Minimum PCB Thickness | 0.40 mm |
| Absolute Maximum PCB Thickness | 3.2 mm |
| For Standard Components | |
| • Maximum size | 420.00 mm x 420.00 mm (Stencil size should not be larger than 290 mm) |
| • Minimum size | 50.00 mm on any side |
| For Component Pitch <= 0.50 mm (BGA/QFN) | |
| • Maximum size | 200.00 mm x 200.00 mm (Solder dam is preferable) |
| PCB Board Thickness Constraints Maximum Sizes | |
| • Thickness (1.00 mm - 3.2 mm) | Maximum size: 420.00 mm x 420.00 mm |
| • Thickness (0.40 mm - 1.00 mm) | Maximum size: 200.00 mm x 200.00 mm |
| • Thickness < 0.40 mm | Not feasible with us |